There are two standards for measuring whether a product is easy to use or durable, one is a hard standard from the quality supervision department, and the other is a user's standard. Cold thermal shock test chamber is one of the reliability testing equipment that the product must use in the design and test stages. It belongs to the environmental test category in the reliability test. Of course, it is also different from the ordinary environmental test chamber. The main purpose of the chamber is to detect what changes the product will produce when the temperature changes rapidly, so as to derive the service life, use environment and defect improvement of the detected product.
(1) What are the uses of the cold thermal shock test chamber?
The thermal shock test chamber is suitable for the safety performance test of electronic components. It provides reliability tests, product screening tests, etc. At the same time, through this equipment test, the reliability of the product and the quality control of the product can be improved.
(2) How to choose the cold thermal shock test chamber?
1. Shock temperature: Shock temperature refers to the maximum temperature range that the test area can actually rise and fall to. Note that it is not the limit temperature of the preheating and precooling room.
2. Test load: This parameter directly affects how many test items can be placed.
3. Recovery time: refers to the time it takes for the test workpiece to switch from one temperature point to another temperature point. Common standards stipulate ≤5min.
4. Defrost time: The longer the defrost interval, the better. Now some manufacturers can do defrosting once with 1000cycles, which is very ideal. The shorter the defrost interval, the worse the air tightness of the device!
5. Sensor placement: The specification requires that the sensor must be placed inside the test area. Some manufacturers place the sensor inside the air duct, although only 10cm away from the test area, but this energy difference is quite large. And can not truly reflect the temperature change of the test workpiece surface.