High and low temperature impact test chamber is used in electronic and electrical components, automation parts, communication components, auto parts, metals, chemical materials, plastics and other industries, defense industry, aerospace, military industry, BGA, PCB substrate, electronic chip IC, semiconductor The physical changes of ceramics and polymer materials, testing the material's repeated resistance to high and low temperatures and the chemical changes or physical damage of the product during thermal expansion and contraction can confirm the quality of the product, from precision IC to heavy machinery All components are used, which is an indispensable test box for product testing in various fields.
Electronic components are the basis of the whole machine. In the manufacturing process, due to inherent defects or improper control of the manufacturing process, failures related to time or stress may form during use. In order to ensure the reliability of the entire batch of components and meet the requirements of the whole machine, the components that may fail in the initial stage under the conditions of use must be eliminated. The process of component failure rate changing with time can be described by a "bathtub curve" failure rate curve. The early failure rate decreases rapidly with time, and the failure rate during the service life (or accidental failure period) is basically not change.
1.High temperature storage:
2.Power electric:
3.Temperature cycling:
4.Necessity of component screening:
